UltraScale and UltraScale+ devices are offered in flip-chip BGA packages, which present a low thermal path. With the exception of the bare-die packages, the flip-chip BGA packages incorporate a heat spreader with an additional thermal interface material (TIM), as shown in This Figure .
Materials with better thermal conductivity and consistent process deliver low thermal resistance to the heat spreader.
A parallel effort to ensure optimized package electrical return paths produces the added benefit of enhanced power and ground plane arrangement in the packages. A boost in copper density on the planes improves the overall thermal conductivity through the laminate. In addition, the extra dense and distributed via fields in the package increase the vertical thermal conductivity.