FSVJ1760 Flip-Chip, Fine-Pitch BGA ( XCVU23P )
UltraScale+ Device Packaging and Pinouts Product Specification User Guide (UG575)
Document ID
UG575
Release Date
2023-05-10
Revision
1.19 English
Figure 4-32:
Package Dimensions for
FSVJ1760
(
XCVU23P
)
X-Ref Target - Figure 4-32
