FSVH2104 ( XCVU33P ) Flip-Chip, Fine-Pitch, Lidless with Stiffener Ring, BGA
UltraScale+ Device Packaging and Pinouts Product Specification User Guide (UG575)
Document ID
UG575
Release Date
2023-05-10
Revision
1.19 English
Figure 4-55:
Package Dimensions for FSVH2104 (
XCVU33P
)
X-Ref Target - Figure 4-55
