FLRC2104 ( XQVU11P ) Ruggedized Flip-Chip, Fine-Pitch BGA
UltraScale+ Device Packaging and Pinouts Product Specification User Guide (UG575)
Document ID
UG575
Release Date
2023-05-10
Revision
1.19 English
Figure 4-47:
Package Dimensions for FLRC2104 (
XQVU11P
)
X-Ref Target - Figure 4-47
