FFVB2104 ( XCKU19P ) Flip-Chip, Fine-Pitch BGA
UltraScale+ Device Packaging and Pinouts Product Specification User Guide (UG575)
Document ID
UG575
Release Date
2023-05-10
Revision
1.19 English
Figure 4-38:
Package Dimensions for FFVB2104 (
XCKU19P
)
X-Ref Target - Figure 4-38
