FBVA900 Bare-die Flip-Chip, Fine-Pitch BGA ( XCKU035 and XCKU040 )

UltraScale+ Device Packaging and Pinouts Product Specification User Guide (UG575)

Document ID
UG575
Release Date
2023-05-10
Revision
1.19 English
Figure 4-12: Package Dimensions for FBVA900 ( XCKU035 and XCKU040 )

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Figure 4-13: FBVA900 Package ( XCKU035 and XCKU040 ) Die Dimensions with Capacitor Locations

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