FBVA676 Bare-die Flip-Chip, Fine-Pitch BGA ( XCKU035 and XCKU040 )

UltraScale+ Device Packaging and Pinouts Product Specification User Guide (UG575)

Document ID
UG575
Release Date
2023-05-10
Revision
1.19 English
Figure 4-4: Package Dimensions for FBVA676 ( XCKU035 and XCKU040 )

X-Ref Target - Figure 4-4

ug575_c4_01.jpg
Figure 4-5: FBVA676 Package ( XCKU035 and XCKU040 ) Die Dimensions with Capacitor Locations

X-Ref Target - Figure 4-5

ug575_c4_02.jpg