Device/Package Combinations

UltraScale+ Device Packaging and Pinouts Product Specification User Guide (UG575)

Document ID

UG575

Release Date

2023-05-10

Revision

1.19 English

Table: Package Specifications shows the size and BGA pitch of the UltraScale and UltraScale+ device packages. The devices with stacked-silicon interconnect (SSI) technology are labeled.

IMPORTANT: All packages are available with eutectic BGA balls. To order these packages, the device type starts with an XQ vs. XC, and the third digit in the package name is Q (for example: FFQA1156).

Table 1-1: Package Specifications
Packages ⁽¹⁾	Description	Package Specifications
Packages ⁽¹⁾	Description	Package Type	Pitch (mm)	Size (mm)
UBVA368	Flip-chip, integrated fan out (InFO), bare-die	BGA	0.5	11.5 x 9.5
SBVB484	Flip-chip, super-fine-pitch		0.8	19 x 19
SBVC484	Flip-chip, super-fine-pitch		0.8	19 x 19
FBVA676	Bare-die, flip-chip, fine-pitch		1.0	27 x 27
FFVA676	Flip-chip, fine-pitch
FFVB676	Flip-chip, fine-pitch
FFRB676	Ruggedized, flip-chip, fine-pitch
RBA676	Ruggedized, flip-chip, fine-pitch
SFVA784	Flip-chip, super-fine-pitch		0.8	23 x 23
SFVB784	Flip-chip, super-fine-pitch
SFRB784	Ruggedized, flip-chip, super-fine pitch
FBVA900	Bare-die, flip-chip, fine-pitch		1.0	31 x 31
FFVD900	Flip-chip, fine-pitch
FFVE900	Flip-chip, fine-pitch
FFVA1156	Flip-chip, fine-pitch			35 x 35
FFRA1156	Ruggedized, flip-chip, fine-pitch
RFA1156	Ruggedized, flip-chip, fine-pitch
VSVA1365	Flip-chip, fine-pitch lidless with stiffener ring		0.92
FFVA1517	Flip-chip, fine-pitch		1.0	40 x 40
FFVC1517
FFVD1517
FFVE1517
FFRC1517	Ruggedized, flip-chip, fine-pitch
FFRE1517	Ruggedized, flip-chip, fine-pitch
RLD1517	Ruggedized, SSI, flip-chip, fine-pitch
FLVA1517	SSI, flip-chip, fine-pitch
FLVD1517	SSI, flip-chip, fine-pitch
FFVA1760	Flip-chip, fine-pitch	BGA	1.0	42.5 x 42.5
FFVB1760
FFVE1760
FFVJ1760
FLVB1760	SSI, flip-chip, fine-pitch
FSVJ1760	SSI, flip-chip, fine-pitch, lidless with stiffener ring
FLGF1924	SSI, flip-chip, fine-pitch			45 x 45
FLVD1924
FLVF1924
FSVH1924	SSI, flip-chip, fine-pitch, lidless with stiffener ring
RLF1924	Ruggedized, SSI, flip-chip, fine-pitch
FFVA2104	Flip-chip, fine-pitch			47.5 x 47.5
FFVB2104
FFVC2104
FLVA2104	SSI, flip-chip, fine-pitch
FLVB2104
FLVC2104
FLGA2104	SSI, flip-chip, fine-pitch, RoHS 6/6 with exemption 15			47.5 x 47.5
FLGB2104
FLGC2104
FLRA2104	Ruggedized, SSI, flip-chip, fine-pitch			47.5 x 47.5
FLRB2104
FLRC2104
FSGD2104	SSI, flip-chip, fine-pitch, lidless with stiffener ring, RoHS 6/6 with exemption 15			47.5 x 47.5
FSVH2104	SSI, flip-chip, fine-pitch, lidless with stiffener ring			47.5 x 47.5
FHGA2104 ⁽²⁾	SSI, flip-chip, fine-pitch, overhang, RoHS 6/6 with exemption 15			52.5 x 52.5
FHGB2104 ⁽²⁾
FHGC2104 ⁽²⁾
FIGD2104 ⁽²⁾	SSI, flip-chip, fine-pitch, overhang, lidless with stiffener ring, RoHS 6/6 with exemption 15			52.5 x 52.5
FLGB2377	SSI, flip-chip, fine-pitch, RoHS 6/6 with exemption 15			50 x 50
FLGA2577	SSI, flip-chip, fine-pitch, RoHS 6/6 with exemption 15			52.5 x 52.5
FSGA2577	SSI, flip-chip, fine-pitch, lidless with stiffener ring, RoHS 6/6 with exemption 15			52.5 x 52.5
FLGA2892	SSI, flip-chip, fine-pitch, RoHS 6/6 with exemption 15	BGA	1.0	55 x 55
FSVH2892	SSI, flip-chip, fine-pitch, lidless with stiffener ring			55 x 55
FSVK2892	SSI, flip-chip, fine-pitch, lidless with stiffener ring			55 x 55
FSVA3824	SSI, flip-chip, fine-pitch, lidless with stiffener ring			65 x 65
FSVB3824	SSI, flip-chip, fine-pitch, lidless with stiffener ring			65 x 65
Notes: 1. FFV, FLV, and FLG packages are footprint compatible when the package code letter designator and pin count are identical. See the UltraScale Architecture and Product Overview ( DS890 ) for specific letter codes and ordering code information. 2. These 52.5 x 52.5 packages have the same PCB ball footprint as the 47.5 x 47.5 packages and are footprint compatible.