For pick-and-place machines to place bare-die flip-chip BGAs onto PCBs, AMD recommends using soft tips or suction cups for the nozzles. This prevents chipping, scratching, or even cracking of the bare die ( This Figure ).
For pick-and-place machines to place bare-die flip-chip BGAs onto PCBs, AMD recommends using soft tips or suction cups for the nozzles. This prevents chipping, scratching, or even cracking of the bare die ( This Figure ).
