Component Clearance Surrounding Edge Bond

UltraScale+ Device Packaging and Pinouts Product Specification User Guide (UG575)

Document ID
UG575
Release Date
2023-05-10
Revision
1.19 English

An adjacent component clearance surrounding the AMD device is necessary to have the 30° to 45° angle required by the for the edge bond dispenser to dispense the edge bond adhesive material. The surrounding component height and distance from the device is validated based on each unique product design layout.