Differences in 3D ICs - Differences in 3D ICs - UG570

UltraScale Architecture Configuration User Guide (UG570)

Document ID
UG570
Release Date
2025-03-04
Revision
1.20.1 English

3D ICs using SSI (Stacked Silicon Interconnect) technology support the same configuration modes as the monolithic devices. See the UltraScale Architecture and Product Data Sheet: Overview (DS890) and the 3D ICs website for more information on devices using SSI technology.

3D ICs have multiple super logic regions (SLRs), each with its own configuration controller. One SLR is defined as the master, while the others are the slaves (see the following table). The configuration banks and the PCIe blocks that support tandem configuration are always located in the master SLR. The SLRs are numbered from 0 at the bottom of the device floorplan.

Table 1. UltraScale Devices Using SSI Technology
Device Master SLR Index Slave SLR Index
KU085 SLR0 SLR1
KU115 SLR0 SLR1
VU125 SLR0 SLR1
VU160 SLR1 SLR0 and SLR2
VU190 SLR1 SLR0 and SLR2
VU440 SLR1 SLR0 and SLR2
VU5P SLR0 SLR1
VU7P SLR0 SLR1
VU9P SLR1 SLR0 and SLR2
VU11P SLR0 SLR1 and SLR2
VU13P SLR1 SLR0, SLR2, and SLR3
VU19P SLR1 SLR0, SLR2, and SLR3
VU27P SLR1 SLR0, SLR2, and SLR3
VU29P SLR1 SLR0, SLR2, and SLR3
VU35P SLR0 SLR1
VU37P SLR0 SLR1 and SLR2
VU45P SLR0 SLR1
VU47P SLR0 SLR1 and SLR2
VU57P SLR0 SLR1 and SLR2
  1. All Master SLRs have a CONFIG_ORDER_INDEX value of 0.