Board Features - UG1713

The SCU35 evaluation board features are listed here. Detailed information for each feature is provided in Board Component Descriptions.

• XCSU35P
• SBVB625 package
• Form factor: see Board Specifications.
• Onboard configuration from:
  • USB-to-JTAG bridge
  • JTAG pod 2 mm 2x7 flat cable connector
  • Quad SPI (QSPI) SPI_24 mode
• Clocks
  • FPGA bank 47 System clock LVDS 100 MHz
  • FPGA bank 47 HyperRAM 200MHz
  • FPGA bank 47 HSIO_CLK_IN design dependent
  • FPGA bank 47 HSIO_CLK_OUT design dependent
• HyperRAM (8 MB)
• I/O Expansion
  • Arduino Shield
    • Analog, GPIO, I2C, SPI
  • HSIO
    • I2C, high speed differential and single-ended I/O
  • MikroBUS (Click) (2)
    • I2C, PWM, SPI, UART
  • Pmods
    • GPIO
  • Raspberry Pi HAT (2)
    • GPIO, I2C, SPI, UART
• User GPIO
  • DIP switch (8-position)
  • Pushbutton switches (5)
  • RGB LEDs (5)
• UARTs (3)
• Three axis linear accelerometer (I2C)
• EEPROM (I2C)
• Power telemetry (I2C)
• USB-C power status and control (I2C)
• SYSMON header
• MII 10/100 Ethernet
• Cooling fan 5V (optional)
• Operational switches and jumper (PROGRAM_B, PUDC_B, boot mode)
• Operational status LEDs (INIT_B, DONE, SYS_PG, PLUG_EVENT, CAP_MIS)
• Debug headers
  • HPIO (2 I/O)
  • HDIO (10 I/O)

The SCU35 evaluation board provides a rapid prototyping platform using the XCSU35P-2SBVB625E device. See the UltraScale Architecture and Product Data Sheet: Overview (DS890) for a feature set overview, description, and ordering information.