Device selection is a crucial step for an application involving resource, performance, power, and package requirements. The recommendation is to select the smallest device that meets your requirements.
PDM supports AMD Kria™ K26, K24, UltraScale+ and Versal devices. Versal device selection includes the family, device, device grade, package, speed grade, temperature grade, and static screening option. You can also initialize the Vccint voltage and process during device selection. The Versal AI Edge Series Gen 2 and Versal Prime Series Gen 2 devices also include PS Voltage, MMD Voltage and AIE Voltage options. Kria device selection includes family, board, device, and grade with only an option to choose the process. Each device has a unique set of functional blocks, while the package selection determines the available I/O and transceivers. For details refer to the product selection guide of the target family. Versal devices support the following temperature grades, each having an impact on power.
- Industrial operating temperature range is –40°C to 100°C.
- Extended operating temperature range is 0°C to 100°C.
- Q-grade operating temperature range is –40°C to 125°C.
- Military operating temperature range is –55°C to 125°C.
The unique power binning strategy of AMD enables lower static power for industrial grade compared to extended grade devices. Versal devices offer enhanced voltage scaling options, which is the key for the highest performance per watt on these devices. Versal devices support the following operating modes:
- High-performance core operating voltage is 0.88V (VHP)
- Mid/balanced power/performance core operating voltage is 0.80V (VMP)
- Low-power core operating voltage is 0.70V (VLP)
The following figures are examples of part selector options based on the selected family
Some device grades of Versal AI Edge Series Gen 2 and Versal Prime Series Gen 2 devices support Voltage overdrive for VCC_MMD and VCC_AIE rail in addition to PS Voltage. You can select the voltage level from MMD Voltage and AIE Voltage drop-down lists in the part selector.
Process represents the manufacturing process variation of the device, which significantly influences leakage power. The process variation model is a common industry practice to meet the yield requirements without violating the device specification. During device manufacturing, the silicon process alters the transistor characteristics, resulting in variations between devices. Typical is the median boundary where the device meets both performance and power specification, while Maximum represents the worst case process variation.