Thermal design is critical for all board designs and must also work for the mechanical design of the application. The thermal design must keep the application within its thermal limits. AMD provides thermal models. These models work with Siemens Flotherm and Ansys IcePack.
You can obtain the Theta Ja of a system through a thermal simulation, which ensures a more accurate power estimation and power delivery solution. Versal devices come in lidless packaging, which provides an optimal thermal solution. However, you must target existing lidded designs to the lidless packaging. Versal devices allow a temperature excursion to 110°C for 3% of lifetime, giving additional thermal margin and simplifying thermal design.
You can refine the initial power estimation with the results of the thermal simulation to get a more accurate estimation of junction temperature. Enter the maximum ambient temperature for the application using the Theta Ja. This approach provides the worst-case static power and ensures the correct design of the power delivery solution.
For more information, refer to the Thermal page on the AMD website and Extending the Thermal Solution by Utilizing Excursion Temperatures (WP517).