Highly Accelerated Temperature and Humidity Stress Test - Highly Accelerated Temperature and Humidity Stress Test - UG116

Device Reliability Report (UG116)

Document ID
UG116
Release Date
2025-07-23
Revision
10.20 English

The HAST test is conducted under the conditions of 130°C, 85% RH and VDD bias or 110°C, 85% RH and VDD bias. Package preconditioning is performed on the testing samples prior to the HAST test.

Summary

Table 1. Summary of High Accelerated Stress Test Results
Device Stress Condition Lot Quantity Fail Quantity Device Quantity Total Device Cycles
XC6Sxxx 110°C / 85%RH 4 0 178 93,984
7 series FPGAs and Zynq 7000 SoCs 110°C / 85%RH 11 0 493 248,424

Data

Table 2. HAST Test Results for XC6Sxxx
Device Stress Condition Lot Quantity Fail Quantity Device Quantity Total Device Cycles
XC6SLX45 110°C / 85%RH 4 0 178 93,984
XC6Sxxx 110°C / 85%RH 4 0 178 93,984
Table 3. HAST Test Results for 7 series FPGAs and Zynq 7000 SoCs
Device Stress Condition Lot Quantity Fail Quantity Device Quantity Total Device Cycles
XC7A35T 110°C / 85%RH 3 0 135 59,400
XC7Z020 110°C / 85%RH 8 0 358 189,024
7 series FPGAs and Zynq 7000 SoCs 110°C / 85%RH 11 0 493 248,424