1 |
64 |
72 |
DDR4: x8, x16 DDR4 3DS: x8 |
1 SDP, 2 DDP |
1 |
32 |
40 |
DDR4: x4, x8, x16 DDR4 3DS: x4,
x8 |
1 SDP, 2 DDP |
1 |
16 |
24 |
DDR4: x4, x8, x16 DDR4 3DS: x4,
x8 |
1 SDP, 2 DDP |
2
2
|
32 |
N/A |
DDR4: x8, x16 DDR4 3DS: x8 |
1 SDP, 2 DDP |
2
2
|
16 |
24 |
DDR4: x8, x16 DDR4 3DS: x8 |
1 SDP, 2 DDP |
- For any
component interface, all memory components must be
identical.
- Some devices use a shared read reorder
buffer for dual channel configuration, and read efficiency will
be affected. Refer to Reordering for
more information.
- Multi-rank for component interfaces is only supported for dual-die
packages. Sharing the DQ bus with multiple components as
separate physical ranks on the PCB is not supported.
|