Mechanical and Thermal - DS985

The production K24 SOM is available in both commercial and industrial temperature grades. The thermal considerations of the K24 SOM must be accounted for on both the programmable SoC device and the SOM system. Considering design specific application power consumption, the overall system must be designed within the constraints of the MPSoC junction temperature specification and thermal plate temperature requirements. The following table outlines the temperature constraints. The first temperature specification is defined relative to the junction temperature of the MPSoC, as measured by the integrated System Monitor. The second temperature specification is defined relative to the temperature measurement on the top surface of the aluminum thermal interface plate. Refer to Kria K24 SOM Thermal Design Guide (UG1094) for details on temperature characterization and product thermal solution development. Your design is expected to have a thermal solution connected to the integrated thermal interface plate, this is to maintain the operating temperature within these limits under the operating conditions (i.e., ambient temperature, airflow, etc.) of your system.

The K24 SOM has an aluminum thermal interface plate. This thermal interface plate makes full contact with all the high-power active components, including the MPSoC, LPDDR4, eMMC, and power regulators. The primary function of the thermal interface plate is to transfer the non-uniform heat distribution of the module that is generated on the PCB assembly to the thermal interface plate, making the heat flux more uniform and spread over a larger surface area. This allows for more efficient heat transfer out of the package to an attached cooling device and simplifies thermal design. The user-defined system cooling solutions should be designed to directly attach to the thermal interface plate.

Figure 1. K24 SOM