Symbol | Description 1 | Min | Max | Units |
---|---|---|---|---|
FPGA Logic |
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VCCINT | Internal supply voltage | –0.500 | 1.000 | V |
VCCINT_IO 2 | Internal supply voltage for the I/O banks | –0.500 | 1.000 | V |
VCCAUX | Auxiliary supply voltage | –0.500 | 2.000 | V |
VCCBRAM | Supply voltage for the block RAM and UltraRAM | –0.500 | 1.000 | V |
VCCO | Output drivers supply voltage for HD I/O banks (VU19P and VU23P only) | –0.500 | 3.400 | V |
Output drivers supply voltage for HP I/O banks and configuration bank 0 | –0.500 | 2.000 | V | |
VCCAUX_IO 3 | Auxiliary supply voltage for the I/O banks | –0.500 | 2.000 | V |
VREF | Input reference voltage for HP I/O banks | –0.500 | 2.000 | V |
VIN 4, 5 , 6 , 7 | I/O input voltage for HD I/O banks (VU19P and VU23P only) | –0.550 | VCCO + 0.550 | V |
I/O input voltage for HP I/O banks | –0.550 | VCCO + 0.550 | V | |
VBATT | Key memory battery backup supply | –0.500 | 2.000 | V |
IDC | Available output current at the pad | –20 | 20 | mA |
IRMS | Available RMS output current at the pad | –20 | 20 | mA |
High Bandwidth Memory (HBM) | ||||
VCC_HBM | Supply voltage for the high-bandwidth memory | –0.300 | 1.500 | V |
VCC_IO_HBM | I/O supply voltage for the high-bandwidth memory | –0.300 | 1.500 | V |
VCCAUX_HBM | Auxiliary supply voltage for the high-bandwidth memory | –0.300 | 3.000 | V |
GTY or GTM Transceiver 8 | ||||
VCCINT_GT | Digital supply voltage for select modules in the GTM transceivers | –0.500 | 1.000 | V |
VMGTAVCC | Analog supply voltage for transceiver circuits | –0.500 | 1.000 | V |
VMGTAVTT | Analog supply voltage for transceiver termination circuits | –0.500 | 1.300 | V |
VMGTVCCAUX | Auxiliary analog Quad PLL (QPLL) voltage supply for transceivers | –0.500 | 1.900 | V |
VMGTREFCLK | Transceiver reference clock absolute input voltage | –0.500 | 1.300 | V |
VMGTAVTTRCAL | Analog supply voltage for the resistor calibration circuit of the transceiver column | –0.500 | 1.300 | V |
VIN | Receiver (RXP/RXN) and transmitter (TXP/TXN) absolute input voltage | –0.500 | 1.200 | V |
IDCIN-FLOAT | DC input current for receiver input pins DC coupled RX termination = floating 9 | – | 10 | mA |
IDCIN-MGTAVTT | DC input current for receiver input pins DC coupled RX termination = VMGTAVTT | – | 10 | mA |
IDCIN-GND | DC input current for receiver input pins DC coupled RX termination = GND 10 | – | 0 | mA |
IDCIN-PROG | DC input current for receiver input pins DC coupled RX termination = programmable 11 | – | 0 | mA |
IDCOUT-FLOAT | DC output current for transmitter pins DC coupled RX termination = floating | – | 6 | mA |
IDCOUT-MGTAVTT | DC output current for transmitter pins DC coupled RX termination = VMGTAVTT | – | 6 | mA |
System Monitor |
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VCCADC | System Monitor supply relative to GNDADC | –0.500 | 2.000 | V |
VREFP | System Monitor reference input relative to GNDADC | –0.500 | 2.000 | V |
Temperature 12 |
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TSTG | Storage temperature for XCVU31P, XCVU33P, XCVU35P, XCVU37P, XCVU45P, XCVU47P, and XCVU57P 13 | –55 | 120 | °C |
Storage temperature (ambient) for all other devices | –65 | 150 | °C | |
TSOL | Maximum dry rework soldering temperature | – | 260 | °C |
Maximum reflow soldering temperature for FFVC1517, FLGF1924, FHGA2104, FHGB2104, FHGC2104, FLGA2104, FLGB2104, FLGC2104, FLVA2104, FLVB2104, FLVC2104, FLGA2577 | – | 245 | °C | |
Maximum reflow soldering temperature for lidless packages with stiffener ring (VSVA1365, FSVJ1760, FIGD2104, FSGD2104, FSVH1924, FSVH2104, FSGA2577, FSVH2892, FSVK2892, FSVA3824, FSVB3824) | – | 240 | °C | |
Maximum reflow soldering temperature for the FFRC1517, FFRA2104, FFRB2104, and FFRC2104 packages | – | 225 | °C | |
Tj | Maximum junction temperature for XCVU31P, XCVU33P, XCVU35P, XCVU37P, XCVU45P, XCVU47P, and XCVU57P | – | 120 | °C |
Maximum junction temperature for all other devices | – | 125 | °C | |
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