Operating Conditions - DS1013

Alveo V80 Data Center Accelerator Cards Data Sheet (DS1013)

Document ID
DS1013
Release Date
2024-05-08
Revision
1.0 English

The following tables provide the required airflow rate and airflow speed to the V80 card under various operating conditions. The thermal design power (TDP) of the V80 card might fluctuate depending on factors such as inlet temperature, CFM/LFM airflow conditions, and the card's placement within the server. The LFM/CFM values for the V80 card, as indicated in the following tables, are significantly lower when the QSFP power is at 3.2W.

Table 1. Inlet Temperature vs Airflow (Out of I/O Bracket) Requirement of PCIe Card Slot (98.4 mm x 40.66 mm) for Normal Flow at Sea Level for 190W TDP with QSFP Power at 4.5W

Inlet Temperature to the Card

(°C)
CFM LFM Static Pressure
25 17.8 413 0.24
30 20.8 482 0.30
35 24.6 573 0.38
40 29.9 695 0.52
Table 2. Inlet Temperature vs Airflow (Out of I/O Bracket) Requirement of PCIe Card Slot (98.4 mm x 40.66 mm) for Normal Flow at 1800m above Sea Level for 190W TDP with QSFP Power at 4.5W

Inlet Temperature to the Card

(°C)
CFM LFM Static Pressure
25 19.8 460 0.28
30 23.2 538 0.35
35 27.5 640 0.46
Table 3. Inlet Temperature vs Airflow (Into I/O Bracket) Requirement of PCIe Card Slot (103.32 mm x 33.49 mm) for Normal Flow at Sea Level for 190W TDP with QSFP Power at 4.5W

Inlet Temperature to the Card

(°C)
CFM LFM Static Pressure
25 8.6 230 0.09
30 9.9 267 0.12
35 11.7 313 0.15
40 13.9 373 0.20
45 16.9 453 0.28
Table 4. Inlet Temperature vs Airflow (Into I/O Bracket) Requirement of PCIe Card Slot (103.32 mm x 33.49 mm) for Normal Flow at 1800m above Sea Level for 190W TDP with QSFP Power at 4.5W

Inlet Temperature to the Card

(°C)
CFM LFM Static Pressure
25 9.5 256 0.11
30 11.1 297 0.14
35 13.0 350 0.18
40 15.6 418 0.24
45 18.9 509 0.34