In addition to the thermal design resources included in the XPE and PDM tools, there are specific package and pinout documents for each device family that are needed for defining your mechanical dimensions. The packaging and pinout documents are referenced in the PCB Design section. Different device-package combinations provide different benefits and thermal performances.
Note:
AMD lidless packages provide direct access to the die. Third-party
thermal solutions allow for more advanced thermal performance vs. traditional
packaging.
Refer to Addressing Thermal Challenges with Innovative Packaging Solutions (WP563) for information on the advantages of AMD lidless packaging.