Revision History - AM013

Versal Adaptive SoC Packaging and Pinouts Architecture Manual (AM013)
Document ID
AM013
Release Date
2025-10-31
Revision
1.8 English

The following table shows the revision history for this document.

Section Revision Summary
10/31/2025 Version 1.8
Table 1 Removed unused package types (NBVA1024, NSVE1369, NSVI1369) and updated LSC ball grid sizes (VSVA1596, VSRA1596, VSRC1596).
User I/O Pins by Device Package Corrected the MIO values for the 2VM3558, 2VM3858, 2VE3504, 2VE3558, 2VE3804, 2VE3858 devices.
Table 2 Updated the I/O banks for the SSVA1440 and SSVA2112 packages.
Device Diagrams Overview Updated the I/O bank notes in Figure 1.
Bank Diagram by Package for VP1202 Revised the VP1202-VSVA2785 note. The previous guidance that specified NC for the power pins corresponding to the LN power group should not be followed.
Figure 1 Revised the X5IO bank information.
Figure 1 Revised the X5IO bank information.
Figure 2 Revised the X5IO bank information.
VIRA1596 Mechanical—XQVC1902 Remove reference to another device in this package.
Packing and Shipping Added packages and values.
Stencil Updated details about the corner spacer.
6/27/2025 Version 1.7
General updates Added Versal AI Edge Series Gen 2 and Versal Prime Series Gen 2 devices throughout document. Added additional Pin Definitions.
PMCMIO, LPDMIO, PMCDIO Pin Definitions Updated guide because the DONE pin is in the output direction.
Transceiver Footprint Compatibility Between Packages Removed unbonded banks from VP2502 devices in VSRB3340 and VSVB3340 packages.
Die Level Bank Numbering Overview Added X5IO information to the I/O Banks section.
ASCII Pinout Files Updated links
Device Diagrams Overview Updated the example diagram.
Peak Package Reflow Temperatures Added XQ packages and reflow temperatures.
Pin Maps Updated the RSVD pins in the following pin maps:
12/09/2024 Version 1.6
General updates Added the VM2152 device in the NFVD1024 and NFVM1369 packages throughout the document.

Added ruggedized packages throughout the document (SBRA484, SSRA784, NSRG1369, SBRJ1369, VIRA1596, VSRA1596, VSRC1596, VSRD1760, VSRA2197, VSRA2785, VSRA3340, VSRB3340).
Table 1 Added ruggedized packages.
Gigabit Transceiver Channels by Device/Package Added ruggedized packages.
User I/O Pins by Device Package Added ruggedized packages.
SelectIO Pin Definitions Added XCC information.
Table 1 Added VCC_SOC_SENSE and GND_VCC_SOC_SENSE pins.
Footprint Compatibility Between Packages Added ruggedized packages to each table.
VC1902 Bank Diagram Overview and Bank Diagram by Package for VC1902 Combined XQVC1902 with VC1902.
VM1802 Bank Diagram Overview and Bank Diagram by Package for VM1802 Combined XQVM1802 with VM1802.
Bank Diagram by Package for VP1902 Updated XY coordinate names on the overview and subsequent diagrams (by package).
VSVA2785 Mechanical—VP1202 Updated image.
Packing and Shipping Added ruggedized packages.
Edge Bonding Implementation Updated Figure 1.
7/02/2024 Version 1.5
General updates Added the SBVJ1369 package for the XCVP1052 device throughout.
VSVB3340 package is updated for the XCVP2502.
Device/Package Combinations Updated Table 1.
VE2202 Bank Diagram Overview Added diagram.
Bank Diagram by Package for VE2202 Added diagram.
VC1502 Bank Diagram Overview Updated the GTY Quad banks for the VC1502.
VP1902 Bank Diagram Overview Added SLR region numbers to each XY coordinate.
Bank Diagram by Package for VP1902 Added SLR region numbers to each XY coordinate for both the VSVA6865 and VSVB6865.
NSVH1369 Package—VE2802 Pin Map Replaced with correct pin map.
NSVH1369 Package—VM2202 Pin Map Updated pin map.
VSVA3340 Mechanical—VP1402 Updated mechanical drawing. Added VSRA3340 package.
VSVA3340 Mechanical—VP1502 Updated mechanical drawing. Added VSRA3340 package.
VSVA3340 Mechanical—VP1552 Updated mechanical drawing.
VSVA3340 Mechanical—VP1702 Updated mechanical drawing. Added VSRA3340 package.
VSVA5601 Mechanical—VP1802 Updated mechanical drawing, incorrect pin names on the bottom view.
VSVA5601 Mechanical—VP2802 Updated mechanical drawing, incorrect pin names on the bottom view.
Package Marking Added the AMD Versal™ device package marking figures.
Peak Package Reflow Temperatures Updated the table with packages and removed Note 1 because the data sheets do not contain more information.
Edge Bonding Implementation Updated Figure 1.
Edge Bonding Guidelines Added discussion on strain gauge measurements.
Edge Bonding Implementation Updated guidelines using Zymet UA 2605 B edge-bonding material.
9/28/2023 Version 1.4
General updates
  • Removed the XCVC1352
  • Removed the VSVC2021 package offering for the XCVP1002 and XCVP1052
  • Added the VP1902 in the VSVA6865 and VSVB6865 packages.
  • Replaced VFVH1760 with VSVH1760 where previously missed.
SelectIO Pin Definitions Updated the C4CIO_PAD description.
Power Pin Definitions Updated the RSVD pin descriptions and added RSVD_VCCINT_SENSE, RSVD_GND_SENSE, and RSVD_VCCINT_GT pins.
PMCMIO, LPDMIO, PMCDIO Pin Definitions Added Note 1.
Die Level Bank Numbering and Device Diagrams Added additional diagrams.
Bank Diagram by Package for VP1202 Added a note before figure Figure 2 and updated GTM Quad 206 to CG [LN] in the VSVA2785 package.
About ASCII Package Files Updated the XPIO/GTMPerf description.
ASCII Pinout Files Added Note 1 and Note 2 to the table.
Pin Maps Added additional diagrams. Updated the LSVA4737 Package—VH1542 Pin Map, LSVA4737 Package—VH1582 Pin Map, LSVA4737 Package—VH1742 Pin Map, and LSVA4737 Package—VH1782 Pin Map.
SFVA784 and SSRA784 Packages—VM1102 Pin Map Updated power pin legend for RSVD_VCCINT_SENSE and RSVD_GND_SENSE.
VSRA2197 Package—VM1502 Pin Map Added pin map.
Mechanical Drawings Added mechanical drawings.
VFVC1596 Mechanical—VM1302 and VM1402 Updated drawing.
NSVH1369 Mechanical—VM2202, VC2602, VC2802, VE2602, and VE2802 Updated drawing and added VM2202 support.
Stencil Added more examples and Figure 3, Figure 2, and Table 1.
Edge Bonding Implementation Updated Figure 1.
3/23/2023 Version 1.3
General updates
  • Added the VH1522, VH1542, VH1582, VH1742, and VH1782 devices.
  • Added the VSVA3697 and LSVA4737 packages.
  • Added the VM2302 and VM2902 bank diagram overviews.
SelectIO Pin Definitions Added the C4CCIO_PAD pin.
Power Pin Definitions Added the VCCINT_IO_HBM, VCC_HBM, and VCCAUX_HBM pins.
Pin Maps Added VFVF1760 pin maps.
Table 8 Removed die flatness and parallelism specifications for all lidless packages.
VSVA2785 Mechanical—VP1202 Replaced with correct image.
Stencil Updated to add both uniform and non-uniform stencil aperture design.
Edge Bonding Implementation Updated both edge-bonding adhesive placement parameters.
11/17/2022 Version 1.2
General updates Added VSVA5601 package. Removed the VSVC2197 package (VM2202, VM2502, VP1202). Changed VFVH1760 package to VSVH1760 for VC2602, VC2802, VE2602, VE2802.
SelectIO Pin Definitions Updated table for XCVN3716 devices including X5IO pins.
Power Pin Definitions Added GND_SENSE and VCCINT_SENSE to the table.
Power Pin Definitions Added VCCAUX_PLL, VCC_FPD, VCC_LPD, VCCAUX_LPD, VCC_HNICX
PMCMIO, LPDMIO, PMCDIO Pin Definitions Added I3CI2C_SCL, I3CI2C_SDA,

and a note to the REF_CLK description.
PMCMIO, LPDMIO, PMCDIO Pin Definitions Added a note to the REF_CLK description.
Die Level Bank Numbering and Device Diagrams Added additional diagrams to this chapter.
VM1102 Bank Diagram Overview Revised diagrams including Bank Diagram by Package for VM1102.
About ASCII Package Files Added an Important note about schematic symbols.
Pin Maps Updated the section with additional pin maps.
Mechanical Drawings Added reference to the 3D CAD STEP models. Updated the section with additional drawings and replaced the LSVC4072 Mechanical—VP1802 figure.
Packing and Shipping Added values to the table and corrected the VSVB2197.
7/05/2022 Version 1.1
General updates Significant data realignment throughout document
Replaced the SFVB625 package with the SFVA784 package for the VM1102 throughout
Added XQ devices
Die Level Bank Numbering and Device Diagrams Added bank diagrams for VC1352, VC1502, VC1702, VM1102, VM1302, VM1402, VM1502, VM2502, and VM2902
I/O Bank Footprint Compatibility between Packages Updated banks and added devices
Transceiver Footprint Compatibility Between Packages Updated and added devices to the tables in this section
ASCII Pinout Files Added links to the AMD Versal™ device package pinout files.
VSVD1760 Package—VM1802 Pin Map Updated image for clarity
Mechanical Drawings Updated the VIVA1596 Mechanical—VC1802 and VC1902, VFVC1760 Mechanical—VM1502 and VM1802, VSVA2197 Mechanical—VC1802, VC1902, and VM1802
Added A4 dimension and VSRD1760 designation to VSVD1760 Mechanical—VC1802, VC1902, and VM1802
Package Marking Added marking for XQ AMD Versal™ devices
Soldering Guidelines Updated jpj1554077106995.html#jpj1554077106995__note_import_rework
Stencil Updated Figure 1
Edge Bonding Implementation Updated table and images
Edge Bond Removal Updated discussion
Conformal Coating Moved section
Guidelines for Thermal Interface Materials Updated the recommendation and added a table
7/16/2020 Version 1.0
Initial release. N/A