Packing and Shipping - AM013

Versal Adaptive SoC Packaging and Pinouts Architecture Manual (AM013)

Document ID
AM013
Release Date
2025-06-27
Revision
1.7 English

AMD Versal™ devices are packed in trays. Trays are used to pack most of AMD surface-mount devices because they provide excellent protection from mechanical damage. In addition, they are manufactured using antistatic material to provide limited protection against ESD damage and can withstand a bake temperature of 125°C.

Table 1. Standard Device Counts per Tray and Box
Package Maximum Number of Devices Per Tray Maximum Number of Units In One Internal Box
SBRA484 84 420
SBVA484 84 420
SBVA625 60 300
SFVA784 60 300
SSRA784 60 300
NBVB1024 27 135
NVFD1024 27 135
NFVB1369 24 72
NSVF1369 24 72
NSVG1369 24 72
NSRG1369 24 72
NSVH1369 24 72
NFVI1369 24 72
NFVM1369 24 72
SBRJ1369 27 135
SBVJ1369 27 135
VFVC1596 21 63
VIRA1596 21 63
VIVA1596 21 63
VSRA1596 21 63
VSVA1596 21 63
VSRC1596 21 63
VFVC1760 21 63
VFVF1760 21 63
VSRD1760 21 63
VSVD1760 21 63
VSVH1760 21 63
VSVI1760 21 63
VSRA2197 12 36
VSVA2197 12 36
VSVB2197 12 36
VSVD2197 12 36
VSRA2785 10 30
VSVA2785 10 30
VSRA3340 10 30
VSVA3340 10 30
VSRB3340 10 30
VSVB3340 10 30
VSVA3697 10 30
LSVC4072 4 12
LSVA4737 4 12
VSVA5601 4 12
VSVA6865 3 9
VSVB6865 3 9
Important: All packages are available with eutectic-SnPb BGA balls. To order these packages, the device type starts with an XQ vs. XC or XA, and the Pb-free signifier in the package name is Q (for example: VSRD1760).