This section describes the packages and pinouts for various organic flip-chip 0.80 mm, 0.92 mm, and 1.00 mm pitch BGA packages.
Important: All standard packages are lead-free (signified by an additional V in
the package name). All devices supported in a particular package are footprint
compatible. Each device is split into I/O banks to allow for flexibility in the choice
of I/O standards. See the
Versal
Adaptive SoC SelectIO Resources Architecture Manual (AM010).
Versal devices use ultra-low alpha (ULA) materials that emit less than 0.002 alpha-particles per cm2 per hour (<0.002 cph/cm2).
Important: All packages are available
with eutectic-SnPb BGA balls. To order these packages, the device type starts with an
XQ. Pb-free signifier in the package name is Q.