Instructions for Removal of Phase-change Material
- Separate the Components
At room temperature, if possible, use a back and forth twisting motion to break the bond between the phase-change thermal interface material and mated components such as the heat sink and Versal device). Refer to the following figure.
Figure 1. Breaking the Bond between Thermal Interface Material and Mated Components
For smaller components (typically 15 mm x 15 mm or less), the bond usually breaks free easily at room temperature. Larger components allow only minimal movement. If components are fragile, heat the component (preferred) or heat sink to about 40°C–60°C before removal.
Follow the 40°C–60°C guideline; however, heating to 35°C can be adequate for your application. You can heat to 70°C, which softens the phase-change thermal interface material and allows easy component separation.
- Scrape Away Thick Residue
For a faster clean-up after components are separated, scrape away any large residual material amounts with a plastic spatula or a wooden tongue depressor. Wipe away excess material using a clean, dry rag.
- Clean Remaining Residue with Solvent
Using a clean cloth/wipe, wet it with your choice of solvent (see the following list) and wipe away any remaining residue.
- Toluene (easiest)
- Acetone (very good)
- Isoparaffinic hydrocarbon: Isopar, Soltrol (trade names) (very good)
- Isopropyl alcohol (OK)
- Working with Laird Material
Safe handling, disposal, and first-aid measures for working with phase-change material are included in the Laird Technologies material safety data sheet (MSDS). Read the MSDS before using or handling. See the Laird Technologies, Inc. website.