The edge bonding technique uses high-adhesion adhesives dispensed along the periphery of a component, as shown in the following figure. AMD recommends edge bonding to improve mechanical reliability. Use it for devices exposed to severe temperature cycling or extreme shock and vibration in space, defense, and telecommunications applications. Designers are expected to evaluate the need for edge bonding based on the requirements of the specific application being implemented. To that effect, edge bonding can be used to reduce strain on larger devices. Strain gauge measurements need to be in the range of ±500 μstrain.
Figure 1. Edge Bonded BGA Packages
