AMD does not have information regarding the reliability of flip-chip BGA packages on a board after exposure to any specific conformal coating process. Therefore, qualify any process using conformal coating for the specific use case to cover the materials and process steps.
Ruggedized XQ packages support conformal coating, with vented lids that allow proper cleaning after etching and before conformal coating application.
Recommended: When a conformal
coating is required, use Parylene-based material to avoid potential risk of
weakening the lid adhesive used in AMD
packages.