Performing External Monitoring - 2022.1 English

Vivado Design Suite User Guide: Power Analysis and Optimization (UG907)

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2022.1 English

Because the device package prevents access to the silicon, junction temperature cannot be measured directly. Junction temperature can be approximated by measuring the temperature of the package, the heat sink, and other locations with a thermocouple. Thermal cameras are also used to visualize the device temperature and thermal dissipation interactions with neighboring components and the larger environment.